GenTak 230™ Product
Temporary Mounting Adhesive

Broad Range of Benefits

• Premixed liquid adhesive
• Dissolves easily in GenSolve TM
• Processing temperatures to 130˚C
• Smooth coating characteristics
• Excellent hardness
• UV fluorescing dye for detection
• Excellent adhesion strength
• Contains no EPA regulated substances

GenTak™ 230 is a liquid spin-on thermoplastic adhesive that is directly applied to wafer surfaces. It is completely safe for front-side devices and offers protection from further processing conditions. The GenTak™ 230 process for wafer mounting includes coating, curing, and mounting steps. It is a dual polymer and dual solvent package designed specifically to meet the requirements in wafer mounting and thinning operations.

Coating and Curing:  Two-coats are used for most mounting applications, where topography of the device wafer is <12 μm. Each coat is spun-on and then fully cured. If a non-perforated carrier is used for the mounting substrate, this carrier receives a coat of GenTak™ 230. If a perforated carrier is used, than both coats of GenTak^TM 230 are  cured onto the wafer. The curing process occurs in two distinct steps a soft bake and a hard bake. The soft bake on a hot-plate is 115-125 °C for 1-3 minutes and the hard bake is 155-160 °C for 1-3 minutes. After curing the GenTak™ 230 is a non-tacky, hard, smooth surface that protects the sensitive structures on the front-side of the wafer. Typical dual coat thickness ranges between 16-30 μm depending on spin-speeds and dispense volume. 

Wafer Mounting:  There are several excellent wafer-mounting tools out on the market.  The primary requirements for the GenTak™ 230 are heat, pressure, vacuum, and cooling. The wafer and carrier are brought into contact inside the bond chamber. Typically, a vacuum is applied to remove any trapped gasses in the bond-line. After this outgas step, heat is applied until the bonding temperature is reached, (130-150°C), then a positive pressure is applied (1-10 psi) for 2-5 minutes. For best results pressure is maintained, while the wafer package is allowed to cool to <110°C. What is observed is a bubble and void free bond-line transparent to optical inspection and alignment tools.

Demounting: The wafer may be removed from the carrier in two ways, manual mechanical or solvent bath.  Utilizing the melting point of the GenTak™ 230 of 170°C the package may be placed on a vacuum hot-plate, heated, and wafer removed and cleaned in GenSolve™ 500. A solvent demount is used for large volume, and thinned wafers <150 μm. A typical demount and cleaning model uses three tanks and a DI water cascading dump rinse.